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DEADLINE EXTENDED

We have received an exceptional number of requests to extend the submission deadline to allow authors to complete their papers.

The VTS’19 organizing committee has therefore decided to extend the submission deadline. The new deadline reported below is final. No further extensions will be granted.

To help the organization of the review process please register your paper on the website as soon as possible. The PDF can then be uploaded and updated as many time as you want until the final deadline.


CALL FOR PAPERS
Scope -- Submissions -- Key Dates -- Additional Information -- Committee
Scope
The IEEE VLSI Test Symposium (VTS) explores emerging trends and novel concepts in testing, reliability and security of microelectronic circuits and systems. The VTS Program Committee invites original, unpublished paper submissions for VTS 2020. Proposals for the innovative practices and special sessions tracks are also invited. Major topics include but are not limited to: Analog/Mixed-Signal/RF Test ATPG & Compression Silicon Debug Automotive Test & Safety Built-In Self-Test (BIST) Defect & Current Based Test Defect/Fault Tolerance Delay & Performance Test Design for Testability (DFT) Design Verification/Validation Embedded System & Board Test Embedded Test Methods Emerging Technologies Test FPGA Test Fault Modeling and Simulation Hardware Security Low-Power IC Test Microsystems/MEMS/Sensors Test Memory Test and Repair On-Line Test & Error Correction Power/Thermal Issues in Test System-on-Chip (SOC) Test Test Standards & Economics Test of Biomedical Devices Test of High-Speed I/O Test Quality and Reliability Test Resource Partitioning Transients and Soft Errors 2.5D, 3D and SiP Test Yield Optimization New hot topics: VTS puts particular emphasis on enlarging its scope soliciting submissions on aspects on the following hot topics: *Testing AI and Neuromorphic Devices, Machine Learning for Test, Test/Reliability/Security in Approximate and Quantum Computing.*
Submissions	top
REGULAR PAPERS The VTS Program Committee invites original, unpublished Paper Submissions for VTS 2020. Paper submissions must be complete manuscripts, up to six pages (inclusive of figures, tables, and bibliography) in a standard IEEE two-column format; papers exceeding the page limit will be returned without review. Authors must clearly explain the significance of the work, highlight novel features, and describe its current status. On the title page, please include: author name(s) and affiliation(s), and the mailing address, phone number, and e-mail address of the contact author. An abstract and five keywords identifying the topic area are also required. By submitting a paper the authors confirm that the paper has not been previously published elsewhere in any medium (paper or electronic) and the research material (including portions or extensions) has not been simultaneously submitted for review and or publication in any form (conference/journal) and will not be submitted for the full duration of the review process. INNOVATIVE PRACTICES TRACKS AND SPECIAL SESSIONS Proposals for the Innovative Practices and Special Sessions tracks are also invited. Innovative Practices Tracks highlight cutting-edge challenges faced by test practitioners, and innovative solutions employed to address them. Special sessions can include panels, embedded tutorials, or hot topic presentations. Innovative practices and special session track proposals should include a title, name and contact information of the session organizer(s), a 150-to-200 word abstract, and a list of prospective participants. Each Special Session will be given the opportunity to publish a paper (ten pages in a standard IEEE two-column format) in the final conference proceedings summarizing the topic covered by the special session. Each Innovative Practices session will have a one page coverage in the final conference proceedings, based on the abstracts of the presentations in that session. All submissions are to be made electronically through the VTS website. A submission will be considered as evidence that, upon acceptance, the author(s) will submit a final camera-ready version of the paper. Registration of at least one author by the camera-ready deadline and presentation of the paper at the symposium are also required for inclusion of the paper in the published proceedings. VTS 2020 will present a Best Paper Award, a Best Special Session Award, and a Best Innovative Practices Session Award based on the evaluations of reviewers, attendees, and an invited panel of judges. We also plan to organize various Student Activities including the TTTC Best Doctoral Thesis Contest and PhD Poster Forum, details for which will be made available through the VTS website.
Key Dates	top
Regular paper registration (title, abstract and authors): ~~October 4th, 2019~~ October 18th, 2019 (EXTENDED FIRM DEADLINES Regular paper PDF upload: ~~October 11th, 2019~~ October 25th, 2019 (EXTENDED FIRM DEADLINE) Special sessions and IP tracks submission: ~~October 11th, 2019~~ October 25th, 2019 (EXTENDED FIRM DEADLINE) Notification of acceptance: December 10th, 2019 Camera ready deadline: February 7, 2020
Additional Information	top
For general information: GENERAL CHAIR Lorena Anghel TIMA lorena.anghel@imag.fr Amit Majumdar Xilinx amajumd@xilinx.com For submission-related information: PROGAM CO-CHAIRS Stefano Di Carlo (Politecnico di Torino) - e-mail: stefano.dicarlo@polito.it Peilin Song (IBM Research) - e-mail: psong@us.ibm.com
Committee	top
General Chair: L .Anghel –TIMA A. Majumdar – Xilinx Program Co-Chairs: S. Di Carlo - Politecnico di Torino P. Song - IBM Research Past Chair: C.-H. Chang – Intel Vice-General Co-Chairs: S. Ravi – Texas Instruments Vice-Program Co-Chairs: S. Natarajan – Intel Sule Ozev - Arizona State University Innovative Practices Track Co-Chairs: J. Colburn – NVIDIA M. Hutner – Teradyne Special Sessions Co-Chairs: J. Dworak - Southern Methodist University M. Michael - University of Cyprus Publications: I. Vatajelu (Chair) - TIMA Laboratory Publicity Co-Chairs: A. Savino - Politecnico di Torino H. Li – CAS New Initiatives: X. Li – CAS New Topics: B. Courtois – BC Consulting B. Kaminska – Simon Fraser U. Corporate Supp.: M. Ricchetti – Synopsys A. Sinha – Intel Finance: C. Patel – UMBC Registration: K. Huang – San Diego State U. Asian Initiatives: H.Kobayashi – Gunma U. Europ. Initiatives: M. Tahoori – KIT Local Arrang.: S.Patil – Qualcomm Audio/Visual: U. Guin – Auburn U. Student Act.: N. Karimi – UMBC Ex-Officio: Y. Zorian – Synopsys Program committee J. Abraham – University of Texas at Austin M. Barragan – TIMA Laboratory B. Becker – Universität Freiburg R. Blanton – Carnegie Melon University A. Bosio – École Centrale de Lyon – INL K. Chakrabarty – Duke University T. Chakraborty – Qualcomm Inc. M. Chao – National Chiao Tung University D. Chen – Iowa State University H. Chen – Mediatek Inc. K. Chung – Qualcomm G. Di Natale – TIMA Laboratory / CNRS W. Dobbelaere – ON Semiconductor G. Fey – TU Hamburg P. Girard – LIRMM / CNRS D. Gizopoulos – University of Athens S. Gupta – University of Southern California G. Harutyunyan – Synopsis S. Hellebrand – University of Paderborn Y. Huang – Mentor, A Siemens Business M. Keim – Mentor, A Siemens Business E. Larsson – Lund University J.F. Li – National Central University W. Li – Intel T. M. Mak – Independent Y. Makris – UT Dallas H. Manhaeve – Ridgetop Europe P. Maxwell – ON Semiconductor S. Mir – TIMA Laboratory Z. Navabi – Worcester Polytechnic Institute A. Orailoglu – University of California, San Diego I. Pomeranz – Purdue University J. Rajski – Mentor, A Siemens Business S. Reddy – University of Iowa E. Sanchez – Politecnico di Torino S. Shoukourian – Synopsys O. Sinanoglu – NYU Abu Dhabi H. Stratigopoulos – Sorbonne University, CNRS, LIP6 F. Su – Intel S. Sunter – Mentor, a Siemens Business M. Taouil – TU Delft M. Tehranipoor – University of Florida C. Thibeault – ETS Montreal L. C. Wang – University of California, Santa Barbara H.J. Wunderlich – University of Stuttgart Steering committee M. Abadir – Abadir & Associates J. Figueras – Universidad Polytecnic de Catalunya A. Ivanov – University of British Columbia M. Nicolaidis – TIMA Laboratory P. Prinetto – Politecnico di Torino A. Singh – Auburn University P. Varma – Real Intent Y. Zorian – Synopsys
For more information, visit us on the web at: http://www.tttc-vts.org/
The 38th IEEE VLSI Test Symopsium is sponsored by the Institute of Electrical and Electronics Engineers (IEEE) Computer Society's Test Technology Technical Council (TTTC).